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Codes & Standards - Purchase
IEC 60050-541:1990
International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
- Trilingual
- Published in 1990
- Published by IEC
Codes & Standards - Purchase
IEC 60050-541:1990/AMD1:2015
Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
- Bilingual
- Published in 2015
- Published by IEC
Codes & Standards - Purchase
IEC 60194-1:2021
Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
- Bilingual
- Published in 2021
- Published by IEC
Codes & Standards - Purchase
IEC 60194-2:2017
Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
- English
- Published in 2017
- Published by IEC
Codes & Standards - Purchase
IEC 60947-4-3:2020
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
- English
- Published in 2020
- Published by IEC
Codes & Standards - Purchase
IEC 61188-5-2:2003
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
- Bilingual
- Published in 2003
- Published by IEC
Codes & Standards - Purchase
IEC 61188-5-3:2007
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
- English, French
- Published in 2007
- Published by IEC
Codes & Standards - Purchase
IEC 61188-5-4:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
- English, French
- Published in 2007
- Published by IEC
Codes & Standards - Purchase
IEC 61188-5-5:2007
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
- English, French
- Published in 2007
- Published by IEC
Codes & Standards - Purchase
IEC 61188-5-8:2007
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
- English, French
- Published in 2007
- Published by IEC
Codes & Standards - Purchase
IEC 61188-6-1:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
- Bilingual
- Published in 2021
- Published by IEC
Codes & Standards - Purchase
IEC 61188-6-4:2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
- Bilingual
- Published in 2019
- Published by IEC
Codes & Standards - Purchase
IEC 61188-7:2017
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
- English, French
- Published in 2017
- Published by IEC
Codes & Standards - Purchase
IEC 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
- Bilingual
- Published in 2013
- Published by IEC
Codes & Standards - Purchase
IEC 61189-1:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- Bilingual
- Published in 1997
- Published by IEC
Codes & Standards - Purchase
IEC 61189-1:1997+AMD1:2001 CSV
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- Bilingual
- Published in 2001
- Published by IEC
Codes & Standards - Purchase
IEC 61189-1:1997/AMD1:2001
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- Bilingual
- Published in 2001
- Published by IEC
Codes & Standards - Purchase
IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
- Bilingual
- Published in 2022
- Published by IEC
Codes & Standards - Purchase
IEC 61189-2-630:2018
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures – Moisture absorption after pressure vessel conditioning
- Bilingual
- Published in 2018
- Published by IEC
Codes & Standards - Purchase
IEC 61189-2-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
- Bilingual
- Published in 2016
- Published by IEC