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Codes & Standards - Purchase
IEC 60050-521:2002/AMD1:2017
Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
- Bilingual
- Published in 2017
- Published by IEC
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IEC 60050-521:2002/AMD2:2018
Amendment 2 - International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
- Bilingual
- Published in 2018
- Published by IEC
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IEC 60191-1:2018
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
- English
- Published in 2018
- Published by IEC
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IEC 60191-2:1966
Mechanical standardization of semiconductor devices. Part 2: Dimensions
- Bilingual
- Published in 1966
- Published by IEC
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IEC 60191-2:1966/AMD10:2004
Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2004
- Published by IEC
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IEC 60191-2:1966/AMD11:2004
Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2004
- Published by IEC
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IEC 60191-2:1966/AMD12:2006
Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2006
- Published by IEC
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IEC 60191-2:1966/AMD13:2006
Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2006
- Published by IEC
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IEC 60191-2:1966/AMD14:2006
Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2006
- Published by IEC
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IEC 60191-2:1966/AMD15:2006
Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2006
- Published by IEC
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IEC 60191-2:1966/AMD16:2007
Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2007
- Published by IEC
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IEC 60191-2:1966/AMD17:2008
Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2008
- Published by IEC
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IEC 60191-2:1966/AMD18:2011
Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2011
- Published by IEC
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IEC 60191-2:1966/AMD19:2012
Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2012
- Published by IEC
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IEC 60191-2:1966/AMD1:2001
Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2001
- Published by IEC
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IEC 60191-2:1966/AMD20:2018
Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- English
- Published in 2018
- Published by IEC
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IEC 60191-2:1966/AMD21:2020
Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- English
- Published in 2020
- Published by IEC
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IEC 60191-2:1966/AMD2:2001
Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2001
- Published by IEC
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IEC 60191-2:1966/AMD3:2001
Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2001
- Published by IEC
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IEC 60191-2:1966/AMD4:2001
Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2001
- Published by IEC
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IEC 60191-2:1966/AMD5:2002
Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
- Bilingual
- Published in 2002
- Published by IEC
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IEC 60191-2:1966/AMD6:2002
Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
- Bilingual
- Published in 2002
- Published by IEC
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IEC 60191-2:1966/AMD7:2002
Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
- Bilingual
- Published in 2002
- Published by IEC
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IEC 60191-2:1966/AMD8:2003
Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
- Bilingual
- Published in 2003
- Published by IEC
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IEC 60191-2:1966/AMD9:2003
Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2003
- Published by IEC
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IEC 60191-2T:1996
Eighteenth supplement
- Bilingual
- Published in 1996
- Published by IEC
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IEC 60191-2U:1997
Nineteenth supplement
- Bilingual
- Published in 1997
- Published by IEC
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IEC 60191-2V:1998
Twentieth supplement
- Bilingual
- Published in 1998
- Published by IEC
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IEC 60191-2W:1999
Twenty-first supplement
- Bilingual
- Published in 1999
- Published by IEC
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IEC 60191-2X:1999
Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 1999
- Published by IEC
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IEC 60191-2X:1999/COR1:2000
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2000
- Published by IEC
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IEC 60191-2Y:2000
Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2000
- Published by IEC
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IEC 60191-2Z:2000
Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
- Bilingual
- Published in 2000
- Published by IEC
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IEC 60191-3:1999
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
- Bilingual
- Published in 1999
- Published by IEC
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IEC 60191-4:2013
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- Bilingual
- Published in 2013
- Published by IEC
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IEC 60191-4:2013+AMD1:2018 CSV
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- Bilingual
- Published in 2018
- Published by IEC
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IEC 60191-4:2013/AMD1:2018
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- Bilingual
- Published in 2018
- Published by IEC
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IEC 60191-5:1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
- Bilingual
- Published in 1997
- Published by IEC
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IEC 60191-6-10:2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
- English, French
- Published in 2003
- Published by IEC
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IEC 60191-6-12:2011
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
- Bilingual
- Published in 2011
- Published by IEC
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IEC 60191-6-13:2016
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
- Bilingual
- Published in 2016
- Published by IEC
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IEC 60191-6-16:2007
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
- English, French
- Published in 2007
- Published by IEC
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IEC 60191-6-17:2011
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
- Bilingual
- Published in 2011
- Published by IEC
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IEC 60191-6-18:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- Bilingual
- Published in 2010
- Published by IEC
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IEC 60191-6-18:2010/COR1:2010
Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- Bilingual
- Published in 2010
- Published by IEC
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IEC 60191-6-18:2010/COR2:2010
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- Bilingual
- Published in 2010
- Published by IEC
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IEC 60191-6-19:2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
- Bilingual
- Published in 2010
- Published by IEC