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Codes & Standards - Purchase

IEC 60068-2-21:2021

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
  • Bilingual
  • Published in 2021
  • Published by IEC
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IEC 60068-2-58:2015

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
  • Bilingual
  • Published in 2015
  • Published by IEC
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IEC 60068-2-58:2015+AMD1:2017 CSV

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
  • English, French
  • Published in 2017
  • Published by IEC
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IEC 60068-2-58:2015/AMD1:2017

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
  • English, French
  • Published in 2017
  • Published by IEC
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IEC 60068-2-69:2017

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
  • Bilingual
  • Published in 2017
  • Published by IEC
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IEC 60068-2-69:2017+AMD1:2019 CSV

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
  • Bilingual
  • Published in 2019
  • Published by IEC
Codes & Standards - Purchase

IEC 60068-2-69:2017/AMD1:2019

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
  • Bilingual
  • Published in 2019
  • Published by IEC
Codes & Standards - Purchase

IEC 60068-2-69:2017/COR1:2018

Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)
  • Bilingual
  • Published in 2018
  • Published by IEC
Codes & Standards - Purchase

IEC 60068-2-77:1999

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
  • English, French
  • Published in 1999
  • Published by IEC
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IEC 60068-2-83:2011

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
  • Bilingual
  • Published in 2011
  • Published by IEC
Codes & Standards - Purchase

IEC 60194-1:2021

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
  • Bilingual
  • Published in 2021
  • Published by IEC
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IEC 60194-2:2017

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
  • English
  • Published in 2017
  • Published by IEC
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IEC 61188-5-2:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
  • Bilingual
  • Published in 2003
  • Published by IEC
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IEC 61188-5-6:2003

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
  • Bilingual
  • Published in 2003
  • Published by IEC
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IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
  • Bilingual
  • Published in 2021
  • Published by IEC
Codes & Standards - Purchase

IEC 61190-1-1:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
  • Bilingual
  • Published in 2002
  • Published by IEC
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IEC 61190-1-2:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
  • Bilingual
  • Published in 2014
  • Published by IEC
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IEC 61190-1-3:2017

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
  • Bilingual
  • Published in 2017
  • Published by IEC
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IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
  • Bilingual
  • Published in 2018
  • Published by IEC
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IEC 61191-1:2018 RLV

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
  • English
  • Published in 2018
  • Published by IEC