Product List
View 1-20 of 59
View 20 | View 100
Codes & Standards - Purchase
IEC 60068-2-21:2021
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
- Bilingual
- Published in 2021
- Published by IEC
Codes & Standards - Purchase
IEC 60068-2-58:2015
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- Bilingual
- Published in 2015
- Published by IEC
Codes & Standards - Purchase
IEC 60068-2-58:2015+AMD1:2017 CSV
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- English, French
- Published in 2017
- Published by IEC
Codes & Standards - Purchase
IEC 60068-2-58:2015/AMD1:2017
Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- English, French
- Published in 2017
- Published by IEC
Codes & Standards - Purchase
IEC 60068-2-69:2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- Bilingual
- Published in 2017
- Published by IEC
Codes & Standards - Purchase
IEC 60068-2-69:2017+AMD1:2019 CSV
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- Bilingual
- Published in 2019
- Published by IEC
Codes & Standards - Purchase
IEC 60068-2-69:2017/AMD1:2019
Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- Bilingual
- Published in 2019
- Published by IEC
Codes & Standards - Purchase
IEC 60068-2-69:2017/COR1:2018
Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)
- Bilingual
- Published in 2018
- Published by IEC
Codes & Standards - Purchase
IEC 60068-2-77:1999
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
- English, French
- Published in 1999
- Published by IEC
Codes & Standards - Purchase
IEC 60068-2-83:2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- Bilingual
- Published in 2011
- Published by IEC
Codes & Standards - Purchase
IEC 60194-1:2021
Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
- Bilingual
- Published in 2021
- Published by IEC
Codes & Standards - Purchase
IEC 60194-2:2017
Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
- English
- Published in 2017
- Published by IEC
Codes & Standards - Purchase
IEC 61188-5-2:2003
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
- Bilingual
- Published in 2003
- Published by IEC
Codes & Standards - Purchase
IEC 61188-5-6:2003
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
- Bilingual
- Published in 2003
- Published by IEC
Codes & Standards - Purchase
IEC 61188-6-1:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
- Bilingual
- Published in 2021
- Published by IEC
Codes & Standards - Purchase
IEC 61190-1-1:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
- Bilingual
- Published in 2002
- Published by IEC
Codes & Standards - Purchase
IEC 61190-1-2:2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
- Bilingual
- Published in 2014
- Published by IEC
Codes & Standards - Purchase
IEC 61190-1-3:2017
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
- Bilingual
- Published in 2017
- Published by IEC
Codes & Standards - Purchase
IEC 61191-1:2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- Bilingual
- Published in 2018
- Published by IEC
Codes & Standards - Purchase
IEC 61191-1:2018 RLV
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- English
- Published in 2018
- Published by IEC