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IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
SKU: iec_061513_113924
Published by IEC
Publication Year 2023
1.0 Edition
21 pages
Product Details
IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.