IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates.
This consolidated version consists of the first edition (2003)
and its amendment 1 (2010). Therefore, no need to order amendment in
addition to this publication.