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IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
SKU: iec_001007_026425
Published by IEC
Publication Year 2000
1.0 Edition
17 pages
Product Details
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.