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IEC 60191-6-22:2012
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
SKU: iec_001006_047287
Published by IEC
Publication Year 2012
1.0 Edition
34 pages
Product Details
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).