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IEC TR 62878-2-7:2019
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
SKU: iec_064202_105763
Published by IEC
Publication Year 2019
1.0 Edition
12 pages
Product Details
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.