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IEC TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
SKU: iec_007469_049626
Published by IEC
Publication Year 2014
1.0 Edition
187 pages
Product Details
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.