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IEC 62899-202-9:2023
Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
SKU: iec_064205_113982
Published by IEC
Publication Year 2023
1.0 Edition
14 pages
Product Details
IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.