IEC 60749-10:2022
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
Product Details
This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:
covers both unattached components and components attached to printed wiring boards;
tolerance limits modified for peak acceleration and pulse duration;
mathematical formulae added for velocity change and equivalent drop height.