Codes & Standards - Purchase
IEC 61760-2:2021
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
SKU: iec_065447_110517
Published by IEC
Publication Year 2021
3 Edition
29 pages
Product Details
IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and popcorning. Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and popcorning. Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.
