Codes & Standards - Purchase
IEC TR 60286-7:2019
Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
SKU: iec_064276_106714
Published by IEC
Publication Year 2019
1.0 Edition
24 pages
Product Details
IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.