IEC 60749-9:2017 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.
This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.
This edition includes the following significant technical changes with respect to the previous edition:
a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;
b) additional variant – ‘adhesive tape pull test’.