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IEC 61249-8-8:1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
SKU: iec_005050_022266
Published by IEC
Publication Year 1997
1.0 Edition
19 pages
Product Details
Provides requirements for the qualification of temporary solder resist coatings.
Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.