Codes & Standards - Purchase
IEC 61188-5-4:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
SKU: iec_004789_038518
Published by IEC
Publication Year 2007
1.0 Edition
15 pages
Product Details
IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with J leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.