Codes & Standards - Purchase
IEC 60749-25:2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
SKU: iec_003363_030855
Published by IEC
Publication Year 2003
1.0 Edition
25 pages
Product Details
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.