Codes & Standards - Purchase
IEC 60749-22:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
SKU: iec_003357_029168
Published by IEC
Publication Year 2002
1.0 Edition
41 pages
Product Details
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.
The contents of the corrigendum of August 2003 have been included in this copy.