Codes & Standards - Purchase
IEC 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
SKU: iec_003350_029752
Published by IEC
Publication Year 2003
1.0 Edition
11 pages
Product Details
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.