Codes & Standards - Purchase
IEC 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
SKU: iec_003346_029645
Published by IEC
Publication Year 2003
1.0 Edition
13 pages
Product Details
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).