Codes & Standards - Purchase
IEC 60191-6-5:2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
SKU: iec_001009_027842
Published by IEC
Publication Year 2001
1.0 Edition
10 pages
Product Details
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.