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IEC 60191-6-4:2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
SKU: iec_001008_030708
Published by IEC
Publication Year 2003
1.0 Edition
16 pages
Product Details
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.