Codes & Standards - Purchase
IEC 60191-6-19:2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
SKU: iec_001001_043820
Published by IEC
Publication Year 2010
1.0 Edition
25 pages
Product Details
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.