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IEC 60191-6-18:2010/COR2:2010
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
SKU: iec_000999_044325
Published by IEC
Publication Year 2010
1.0 Edition
1 pages
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