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IEC 60191-4:2013
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
SKU: iec_000990_048698
Published by IEC
Publication Year 2013
3.0 Edition
48 pages
Product Details
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code S is added to indicate a silicon based package.
b) Description of WL is added to be used for general use.
a) Material code S is added to indicate a silicon based package.
b) Description of WL is added to be used for general use.